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7131-108-18

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Mfr. #:
7131-108-18
Batch:
new
Description:
IC Socket Adapter HB2E Relay to DIP, 0.3" (7.62mm) Row Through Hole
Datasheet:
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Specifications
frequently asked question
Product AttributeAttribute Value
Manufacturer Aries Electronics
Series -
Package Bulk
Convert from (Adapter End) HB2E Relay
Convert to (Adapter End) DIP, 0.3" (7.62mm) Row Spacing
Number of Pins 8
Pitch- Mating -
Contact Finish- Mating -
Mounting Type Through Hole
Termination Solder
Pitch- Post -
Contact Finish- Post Tin-Lead
Case Material -
Board Material FR4 Epoxy Glass
Termination Post Length 0.125" (3.18mm)
Material Flammability Rating -
Features -
Operating Temperature -
Contact Material- Mating -
Contact Material- Column Brass
Contact surface treatment thickness - Mating -
Contact surface treatment thickness - Column 200.0μin (5.08μm)
7131-10
Other product information

Advantage price,7131-108-18 in stock can be shipped on the same day

In Stock: Inquiry
Qty.Unit PriceExt. Price
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Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
Inquiry
Minimum:
1
MPQ:
Multiples:
1
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